Qikun Feng

3PUBLICATIONS
14CO-AUTHORS
Electrical circuits and systemsWearable materials
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Publications (3)

|Oct 26, 2026
Molecular Conversion of Thermally Stable Cu-Ag Networks for Mechanically Robust Printed Electronics.

|Sep 09, 2026
Preceramic Precursor Enabled Multifunctional High-Temperature Coatings.

|May 14, 2026
A molecular pathway to corrosion-resistant printable copper.

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Frequent Collaborators

3 joint publications

Shenqiang Ren

2 joint publications

Zhongxuan Wang

1 joint publications

Jun Zhang

1 joint publications

Qiubo Zhang