A molecular pathway to corrosion-resistant printable copper.

Area of Science:

• Materials Science
• Electrochemistry
• Surface Chemistry

Background:

• Copper's high electrical and thermal conductivity are vital for electronics and energy systems.
• Oxidation and corrosion compromise copper's reliability, necessitating complex protection methods.
• Existing copper protection often requires high temperatures or multiple processing steps.

Purpose of the Study:

• To develop a low-temperature molecularly reactive strategy for copper precursor conversion.
• To achieve simultaneous surface passivation and interparticle fusion at <150°C.
• To create flexible copper with enhanced stability and low resistivity.

Main Methods:

• Utilizing catechol-based ligands for copper reduction and surface passivation.
• Employing a molecularly reactive approach for low-temperature processing (<150°C).
• Characterizing the resulting copper's electrical, thermal, and stability properties.

Main Results:

• Successful conversion of copper precursors to metallic copper at <150°C.
• Formation of an ultrathin carbonaceous and copper(I) surface passivation layer.
• Achieved flexible copper with low resistivity and exceptional stability (>1000 hours in acid, >200 hours in sulfide, >240 hours at 140°C).

Conclusions:

• The molecularly reactive strategy effectively resolves the trade-off between conductivity, corrosion resistance, and processability.
• This method enables the production of high-performance, stable copper for next-generation flexible electronics and energy systems.
• The catechol-based ligand approach offers a scalable and efficient route to advanced copper materials.