Spatiotemporal Analysis of Coupled Thermo-Photoelastic Fields in Anisotropic Fiber-Reinforced Silicon Using an...

This study investigates a coupled thermo-photoelastic system in an anisotropic fiber-reinforced silicon semiconductor medium, aiming to capture the interaction between thermal, carrier, and mechanical fields. Such anisotropic fiber-reinforced materials play a crucial role in modern engineering applications, including microelectronic and optoelectronic devices, laser-based technologies, sensors, and advanced composite structures, where directional properties and enhanced mechanical performance are required. They are particularly important in the design of semiconductor components subjected to thermal and optical loading, where accurate prediction of coupled field behavior is essential for reliability and performance optimization. The governing equations are formulated based on the coupled physical model and subsequently transformed into a dimensionless form to simplify the analysis and highlight the relative influence of the involved parameters. The problem is solved using a normal mode technique and reduced to a first-order vector-matrix differential system, followed by an eigenvalue approach to obtain analytical solutions satisfying the imposed boundary conditions within a semi-infinite domain. Numerical analysis is carried out to examine the effect of time variation on all physical fields, revealing strong spatial attenuation and coupled behavior governed by anisotropy and fiber reinforcement. Spatiotemporal heatmap representations are used to visualize the evolution and localization of the fields, providing physical insight into the multiphysical interactions and demonstrating the effectiveness of the analytical approach.