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Related Concept Videos

Thermal Stress01:09

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...
Non-ohmic Devices00:51

Non-ohmic Devices

In most substances, the current flow is proportional to the voltage applied to it. A simple relationship between the values of current, voltage, and resistance is known as Ohm's law. Nonohmic devices do not exhibit a linear relationship between voltage and current. One such device is the semiconducting circuit element known as a diode. A diode is a circuit device that allows current flow in only one direction.
Consider a simple circuit consisting of a battery, a diode, and a resistor. A diode...
Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55 °C.
Mechanism of heat transfer01:19

Mechanism of heat transfer

Understanding heat transfer mechanisms is essential for understanding how our bodies maintain balance in different environmental conditions. When the environment is thermoneutral, the body is in a state of balance, neither using nor releasing energy to maintain its core temperature. However, when the environment is not thermoneutral, the body employs four heat transfer mechanisms to maintain homeostasis: conduction, convection, evaporation, and radiation. These mechanisms facilitate heat...
Thermal Strain01:19

Thermal Strain

Thermal strain is a concept that arises when we consider how temperature changes affect structures. Unlike the conventional assumption that structures remain constant under load, real-world scenarios often involve temperature fluctuations that can significantly impact these structures. Consider a homogeneous rod with a uniform cross-section resting freely on a flat horizontal surface. If the rod's temperature increases, the rod elongates. This elongation is proportional to the temperature...
iChip01:24

iChip

The cultivation of environmental microorganisms has long been hindered by the inability to replicate complex native conditions in vitro. The isolation chip (iChip) addresses this limitation by facilitating the growth of previously uncultivable microorganisms through in situ incubation. Designed for high-throughput microbial cultivation, the iChip comprises hundreds of microchambers, each capable of housing a single microbial cell. These microchambers are loaded with a mixture of molten agar and...

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Related Experiment Video

Updated: Jun 4, 2026

Thermal Measurement Techniques in Analytical Microfluidic Devices
08:29

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

Thermal Utilization on Chip.

Yaohao Zhang1,2, Bo Lai1, Fei Yu2

  • 1State Key Laboratory of Luminescence Science and Technology, Changchun Institute of Optics, Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun, China.

Light, Science & Applications
|June 2, 2026
PubMed
Summary
This summary is machine-generated.

This study introduces an on-chip thermal recovery system using hydrovoltaic generator technology. The system efficiently dissipates heat and converts waste heat into electrical energy, significantly improving energy utilization for electronic devices.

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Fabrication and Testing of Photonic Thermometers
08:44

Fabrication and Testing of Photonic Thermometers

Published on: October 24, 2018

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Last Updated: Jun 4, 2026

Thermal Measurement Techniques in Analytical Microfluidic Devices
08:29

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

Fabrication and Testing of Photonic Thermometers
08:44

Fabrication and Testing of Photonic Thermometers

Published on: October 24, 2018

Area of Science:

  • Materials Science
  • Energy Harvesting
  • Semiconductor Physics

Background:

  • Chip integration and miniaturization increase power consumption and heat generation.
  • Conventional cooling systems consume over 50% of input energy, with no solution for on-chip thermal loss.
  • Existing thermal management technologies are insufficient for addressing on-chip heat accumulation.

Purpose of the Study:

  • To develop an integrated on-chip thermal recovery system.
  • To simultaneously achieve efficient heat dissipation and energy harvesting.
  • To enhance overall energy utilization efficiency in electronic components.

Main Methods:

  • Utilized hydrovoltaic generator (HEG) technology, comprising electrodes and gel.
  • Integrated the HEG system with a deep ultraviolet LED chip (236 nm) as a prototype.
  • Tested the system on a commercial Intel G3220 CPU chip.

Main Results:

  • Maintained prototype chip temperature below 40°C while converting waste heat to electrical energy.
  • Achieved a 610.70% improvement in overall energy utilization efficiency for the LED chip.
  • Reduced commercial CPU temperature from 93°C to below 60°C using four HEG units.

Conclusions:

  • The proposed on-chip thermal recovery system effectively manages heat and harvests energy.
  • Demonstrated significant improvements in energy utilization efficiency and chip performance.
  • The technology shows general applicability for commercial CPUs, enhancing lifespan and computational performance.