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Updated: Jun 5, 2026

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Fabrication of Silica Ultra High Quality Factor Microresonators
Published on: July 2, 2012
Ultrahigh-Q integrated flame-hydrolysis-deposited germano-silicate resonators on silicon.
Hao-Jing Chen1, Kellan Colburn2, Hanfei Hou3
1T. J. Watson Laboratory of Applied Physics, California Institute of Technology, Pasadena, CA, USA. haojing@caltech.edu.
Light, Science & Applications
|June 3, 2026
Summary
Researchers adapted flame hydrolysis deposition for wafer-scale integrated photonics, achieving ultrahigh-Q microresonators. This breakthrough enables fiber-level low loss in photonic integrated circuits for AI-driven communications.
Area of Science:
- Photonics
- Materials Science
- Optical Engineering
Background:
- Global telecommunications rely on optical fibres with ultra-low transmission loss.
- Integrated photonic devices are crucial for data-intensive communications, especially in the AI era.
- Extending low-loss performance to integrated photonics remains a significant challenge.
Purpose of the Study:
- To translate the flame hydrolysis deposition (FHD) mass-production process from optical fibre manufacturing to wafer-scale integrated photonics.
- To demonstrate ultrahigh-Q integrated microresonators using this adapted process.
- To establish a scalable route for achieving fiber-level loss in photonic integrated circuits.
Main Methods:
- Leveraging high GeO2 doping in germano-silicate (Ge:silica) films for full densification at moderate thermal budgets.
- Employing a post-processing furnace-reflow technique to repair etch-induced defects and enhance optical Q.
- Utilizing deep-UV lithography in conjunction with the Ge:silica films to fabricate microresonators.
Main Results:
- Demonstrated ultrahigh Q factors of up to 566 million at 1064 nm.
- Achieved waveguide propagation loss as low as 0.07 dB m⁻¹.
- Devices exhibit broad transmission windows with Q factors > 100 million across telecommunications to violet spectrum, with Q recovery up to two orders of magnitude via furnace reflow.
Conclusions:
- The adapted FHD process successfully extends high-quality, high-rate deposition to integrated photonics.
- The developed Ge:silica films and furnace-reflow technique offer high process tolerance and enable ultrahigh Q factors.
- This work presents a scalable pathway towards achieving fiber-level loss in photonic integrated circuits, crucial for future AI applications.

