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Updated: Jun 13, 2026
05:51
Large Area Substrate-Based Nanofabrication of Controllable and Customizable Gold Nanoparticles Via Capped Dewetting
Published on: February 26, 2019
High-Concentration Gold Nanoparticle Pastes for Advanced Deposition-Based Sensor Manufacturing.
Aleksandra Motyka1,2, Sławomir Drozdek1,3, Nina Szczotka1,4
1XTPL SA, Legnicka 48E, 54-202 Wrocław, Poland.
Sensors (Basel, Switzerland)
|June 12, 2026
Summary
Ultra-Precise Dispensing of gold nanoparticle paste enables high-resolution, mechanically robust conductive patterns for advanced sensors. This additive manufacturing approach overcomes limitations of traditional methods for microelectronics fabrication.
Area of Science:
- Materials Science
- Nanotechnology
- Microelectronics Engineering
Background:
- Next-generation sensing systems demand miniaturized, sensitive, and flexible conductive architectures.
- Conventional thin-film techniques face limitations in mechanical strength, processing complexity, and cost.
- Traditional printing methods struggle with low viscosity, low metal loading, and material waste.
Purpose of the Study:
- To evaluate the morphological fidelity, mechanical resilience, and electrical performance of high-concentration gold nanoparticle paste using Ultra-Precise Dispensing (UPD).
- To demonstrate the fabrication of complex, high-density fractal geometries with fine linewidths on various substrates.
- To assess the suitability of this additive manufacturing approach for microelectronics, including temperature sensing applications.
Main Methods:
- Rheological tailoring of a gold nanoparticle paste with over 90% concentration.
- Deposition using Ultra-Precise Dispensing (UPD) technology to create fractal geometries.
- Characterization of morphological fidelity, mechanical integrity (360-degree bending), and electrical performance on rigid (glass) and flexible (polyimide) substrates.
- Evaluation of a printed temperature sensor's stability and thermal response.
Main Results:
- Achieved printing of complex fractal geometries with linewidths as fine as 5 μm.
- Demonstrated good morphological fidelity and mechanical structural integrity of conductive traces under bending stress.
- Fabricated a stable temperature sensor with a linear thermal response and a temperature coefficient of resistance of 1.98 × 10-3 °C-1.
Conclusions:
- Ultra-Precise Dispensing of high-concentration gold nanoparticle paste is a viable additive manufacturing method for microelectronics.
- This approach offers high resolution, mechanical robustness, and good electrical performance, suitable for flexible and wearable devices.
- The validated material-deposition technique paves the way for advanced microelectronic sensors and circuits.
