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Finite element analysis of warpage and debonding behavior in RDL-first and molding-first fan-out panel-level
Chih-Ping Hu1, Ming-Hsien Shih2, Chun-Chieh Hung1
1Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan.
Scientific Reports
|June 15, 2026
Summary
This study uses finite element analysis (FEA) to assess carrier materials for fan-out panel-level packaging (FOPLP). Results guide carrier selection and process optimization for advanced FOPLP manufacturing.
Area of Science:
- Materials Science
- Mechanical Engineering
- Semiconductor Manufacturing
Background:
- Fan-out panel-level packaging (FOPLP) is crucial for advanced semiconductor devices.
- Carrier material selection significantly impacts FOPLP process reliability and performance.
- Understanding thermo-mechanical behavior during FOPLP is essential for process optimization.
Purpose of the Study:
- To investigate the suitability of steel, glass, and ceramic carriers in FOPLP processes.
- To evaluate warpage and stress distribution for RDL-first and molding-first FOPLP flows.
- To establish design guidelines for carrier selection and process optimization in FOPLP.
Main Methods:
- Finite element analysis (FEA) was employed to simulate FOPLP processes.
- Numerical simulations covered RDL-first and molding-first flows with varying panel dimensions and conditions.
- The element birth and death technique accounted for material changes during simulations.
Main Results:
- The average reference temperature yielded the lowest prediction error in the RDL-first process.
- Maximum von Mises stress was consistently observed in the RM 1 and WAL layers.
- Significant warpage increase occurred during the debonding stage in the molding-first process.
Conclusions:
- FEA simulations accurately predict warpage and stress in FOPLP, validated by experimental data.
- Carrier material choice and process flow critically influence thermo-mechanical outcomes.
- This study provides essential guidelines for optimizing FOPLP carrier selection and manufacturing processes.
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