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Related Concept Videos

Preparation of Samples for Electron Microscopy01:20

Preparation of Samples for Electron Microscopy

To be visualized by an electron microscope, either transmission or scanning, biological samples need to be fixed (stabilized) so the electron beam does not destroy them and dried thoroughly (desiccated/dehydrated) so the vacuum does not affect them. Fixation needs to be done as quickly as possible because the sample properties will start changing as soon as it is removed from its natural environment. For example, in a tissue sample, the oxygen levels begin decreasing, causing an altered...

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Dry Development of Dry Coated Sn-Based Inorganic Resist for Defect-Suppressed and High-Resolution Patterning Process.

Hee Ju Kim1, Min Cheol Kim2, Geun Young Yeom1,3

  • 1School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, South Korea.

Small Methods
|June 24, 2026
PubMed
Summary
This summary is machine-generated.

This study introduces asynchronously pulsed plasma development for tin-based resists, significantly reducing defects and line-edge roughness. This novel technique enhances patterning fidelity for sub-10 nm critical dimensions (CD) and improves process stability.

Keywords:
dry developmentdry resistinorganic photoresistmetal oxide resistplasma developmentpulsed plasma

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Area of Science:

  • Materials Science
  • Plasma Physics
  • Semiconductor Manufacturing

Background:

  • Semiconductor technology demands advanced patterning for sub-10 nm critical dimension (CD) control.
  • Existing wet development methods face challenges with defectivity and process control.

Purpose of the Study:

  • To propose and evaluate a novel asynchronous pulsed plasma development process for Sn-based inorganic dry resists.
  • To enhance patterning fidelity and process stability in next-generation lithography.

Main Methods:

  • Utilized asynchronously pulsed plasma with alternate source and bias RF power application.
  • Developed Sn-based inorganic dry resists.
  • Characterized defectivity, line-edge roughness (LER), and process stability compared to wet development.

Main Results:

  • Pulsed plasma development achieved high chemical contrast and minimized physical damage.
  • Reduced defectivity (line bridging, scum) and LER by approximately 29%.
  • Mitigated defects from airborne molecular contamination (AMC) and resist aging, enhancing process stability.

Conclusions:

  • Asynchronously pulsed plasma development offers a highly selective, low-damage, defect-suppressing strategy for high-resolution lithography.
  • The technique improves patterning fidelity for sub-10 nm features and broadens the lithography process margin.
  • Demonstrated potential for both spin-coated and dry-deposited resists, regardless of deposition method.