Related Experiment Video
Updated: Jun 27, 2026

Fabrication of Schottky Diodes on Zn-polar BeMgZnO/ZnO Heterostructure Grown by Plasma-assisted Molecular Beam Epitaxy
Published on: October 23, 2018
Design and Simulation of a High-Performance GaN Vertical Merged P-i-N/Schottky (MPS) Diode with Multi-Drift-Layer and
Yun Seop Yu1, Saebin Yoon1, Jong Hyeok Oh1
1ICT & Robotics Engineering, Semiconductor Convergence Engineering, AISPC Laboratory and IITC, Hankyong National University, 327 Jungang-ro, Anseong-si 17579, Gyenggi-do, Republic of Korea.
Abstract:
This paper presents the design, structural optimization, and two-dimensional (2D) technology computer-aided design (TCAD) simulation of a gallium nitride (GaN) vertical Merged P-i-N/Schottky (MPS) diode incorporating a multi-drift-layer doping profile, composite SiO2/Si3N4 passivation, and field-plate (FP) termination. The proposed device is constructed on an n+-GaN substrate with a three-sub-layer n-type drift region and a p-GaN/p+-GaN anode region. Systematic TCAD simulations are performed to investigate the dependences of key performance metrics-including knee voltage (Vknee), specific on-resistance (Ron), breakdown voltage (BV), reverse leakage current (Jleak), and Baliga's figure of merit (BFOM)-on the Schottky metal work function, multi-drift-layer doping concentration, drift-layer thickness, Schottky-to-PN contact length ratio (γw), operating temperature, and reverse recovery switching transients. Results demonstrate that the MPS architecture effectively decouples forward conduction loss from reverse blocking capability, overcoming the conventional Ron-BV trade-off. The optimal doping profile (nmm = 2 × 1015, nm = 2 × 1015, n = 1 × 1016 cm-3) achieves a BFOM of ~31.97 GW·cm-2 with BV ≈ 5.98 kV and Ron ≈ 1.12 mΩ·cm2. Joint doping-thickness optimization further identifies a graded doping profile (nmm = 2 × 1015, nm = 5 × 1015, n = 1 × 1016 cm-3) combined with layer thicknesses (Tnmm, Tnm, Tn) = (4.49, 5, 20) μm as the overall optimum, achieving BFOM = 55.36 GW·cm-2 (BV = 6.61 kV, Ron = 0.79 mΩ·cm2)-a +73% improvement, governed by the punch-through/field-stop design principle. The optimal contact ratio of γw = 1.33 yields a BFOM of 38.71 GW·cm-2. Temperature analysis confirms a positive BV temperature coefficient due to drift-region-limited avalanche breakdown, and the BFOM improves monotonically from 33.31 to 37.82 GW·cm-2 between 200 K and 450 K. Mixed-mode switching simulations show that increasing γw substantially reduces reverse recovery charge (Qrr), demonstrating the strong potential of the proposed MPS diode for high-voltage, high-frequency, and high-temperature power electronic applications.
Related Concept Videos
Schottky Barrier Diode
Modeling of Diode Reverse Characteristics
When a reverse voltage applied to a Zener diode exceeds its breakdown voltage, the diode enters the breakdown region. At this point, the...
MOSFET: Depletion Mode
The primary characteristic of depletion-mode MOSFETs is their ability to conduct current between the drain and source terminals without gate bias. This inherent conductivity arises...
MOSFET: Enhancement Mode
In their basic form, enhancement-mode MOSFETs are typically non-conductive when the gate-source voltage (Vgs) is zero. This default 'off' state means no current...
Modeling of Diode Forward Characteristics
Biasing of P-N Junction
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...

