Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Fabrication of Sub-10 μm Microvias Using Nanosecond UV Laser Drilling and a Sacrificial Metal Barrier Layer for Advanced Fine-Pitch Packaging.

Micromachines·2026
Same author

A nutritional link to antimicrobial resistance: iron scarcity promotes plasmid co-selection in <i>Escherichia coli</i>.

Applied and environmental microbiology·2026
Same author

Super-moiré spin textures revealed.

Nature nanotechnology·2026
Same author

Sunyaev-Zeldovich detection of hot intracluster gas at redshift 4.3.

Nature·2026
Same author

Impact of CrIS-Derived NH<sub>3</sub> Emission Updates on Simulated Nitrate and Ammonium Aerosols over East Asia.

Environmental science & technology·2025
Same author

Comparative Efficacy and Safety of Stillen<sup>®</sup> and Rebamipide in Patients with Acute or Chronic Gastritis: A Systematic Review and Network Meta-Analysis of Randomized Controlled Trials.

Journal of clinical medicine·2025

Related Experiment Video

Updated: Jun 27, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

Process Integration and Reliability Challenges of Through-Glass Vias for Glass-Based Advanced Packaging: A Focused

Dong Bae Park1,2, Jinho Jo3, Seonwoo Kim3

  • 1Center for Cooperative Research Facilities, Tech University of Korea, 65 Emtibeuibuk-ro, Siheung-si 15119, Gyeonggi-do, Republic of Korea.

Micromachines
|June 26, 2026
PubMed
Summary

Glass substrates with through-glass vias (TGVs) are crucial for advanced packaging. This review details TGV formation, metallization, defect control, and alternative structures for high-density interconnects.

Keywords:
Cu fillingadvanced packagingconductive paste pluggingglass substratemetallizationthrough-glass via

More Related Videos

Optimized Sealing Process and Real-Time Monitoring of Glass-to-Metal Seal Structures
04:41

Optimized Sealing Process and Real-Time Monitoring of Glass-to-Metal Seal Structures

Published on: September 2, 2019

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

Related Experiment Videos

Last Updated: Jun 27, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

Optimized Sealing Process and Real-Time Monitoring of Glass-to-Metal Seal Structures
04:41

Optimized Sealing Process and Real-Time Monitoring of Glass-to-Metal Seal Structures

Published on: September 2, 2019

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

Area of Science:

  • Materials Science
  • Electrical Engineering
  • Semiconductor Manufacturing

Background:

  • Advanced packaging demands high-density vertical interconnects and low-loss platforms, driving interest in glass substrates.
  • Glass substrates offer low dielectric loss, high dimensional stability, and compatibility with panel-level processing.
  • Through-glass vias (TGVs) are critical for electrical integration in glass-based advanced packaging.

Purpose of the Study:

  • To provide a comprehensive review of Through-Glass Via (TGV) technologies for advanced packaging applications.
  • To compare various TGV formation methods, metallization techniques, and copper filling strategies.
  • To analyze defect formation, reliability concerns, and alternative plugging architectures for TGVs.

Main Methods:

  • Comparative analysis of TGV formation techniques: laser drilling, etching, and photosensitive glass processing.
  • Review of metallization approaches: sputtering, electroless plating, ALD/CVD, and hybrid processes.
  • Discussion of copper electroplating strategies and defect characterization methods.

Main Results:

  • Various TGV formation methods present distinct advantages and challenges for manufacturability.
  • Different metallization and copper filling techniques impact void formation, seam defects, and reliability.
  • Key defects like voids, delamination, and cracking affect thermomechanical reliability, necessitating careful process control.

Conclusions:

  • Through-glass via (TGV) technology is essential for next-generation glass-based advanced packaging.
  • Optimizing TGV formation, metallization, and filling is crucial for achieving high performance and reliability.
  • Alternative plugging strategies offer solutions for balancing electrical performance, manufacturability, and cost.