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Published on: November 11, 2022
Fast Click Crosslinking Bio-Inspired Adhesives With Tailored Hierarchical High Bonding and Exceptional Versatility.
Yuhong Yang1, Jinping Yu1, Ying Huang1
1State Key Laboratory for Environment-Friendly Energy Materials & Inertial Confinement Fusion Energy Materials Key Laboratory of Sichuan Province & School of Materials and Chemistry, Southwest University of Science and Technology, Mianyang, China.
A novel epoxy adhesive cures rapidly at room temperature without heat, offering enhanced strength and flexibility. This breakthrough addresses limitations in extreme environments and provides intrinsic antibacterial properties for advanced material applications.
Area of Science:
- Materials Science
- Polymer Chemistry
- Adhesive Technology
Background:
- Epoxy resins suffer from slow room-temperature curing and brittle failure at low temperatures, limiting their use in extreme conditions.
- Conventional accelerators improve curing speed but cause exothermic heat, embrittlement, and toxic emissions.
Purpose of the Study:
- To develop a room-temperature curable epoxy adhesive with enhanced cohesive strength and interfacial adhesion for extreme environments.
- To leverage mussel-inspired chemistry and click chemistry for a novel adhesive formulation.
Main Methods:
- Utilized triazolinedione-indole (TAD-indole) click chemistry for rapid, heat-free crosslinking.
- Engineered crosslinking sites with dicarbonyl hydrogen bond acceptors for synergistic property enhancement.
- Investigated the adhesive's performance across a wide temperature range (-196°C to 80°C) and after water immersion.
Main Results:
- Achieved second-scale room-temperature curing with a novel epoxy adhesive (RTIA).
- RTIA demonstrated a dry shear strength of 9.42 MPa, retaining 3.12 MPa after boiling water treatment.
- Exhibited stable performance from -196°C to 80°C and intrinsic antibacterial properties suppressing bacterial adhesion.
Conclusions:
- The TAD-indole click chemistry strategy provides a heat-free curing mechanism, overcoming limitations of conventional accelerators.
- This approach enables simultaneous enhancement of cohesive strength and interfacial adhesion, creating a high-performance structural adhesive.
- The developed adhesive is suitable for instantaneous on-site processing and deployment in extreme environments, establishing a new design paradigm.

