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Published on: June 23, 2017
Interfacial Engineering Enables Flexible Composite Film Achieving Ultrahigh Thermal Conductivity and Wave
Kaiyuan Li1,2, Linhong Li3, Guichen Song4
1State Key Laboratory of Advanced Marine Materials, Zhejiang Key Laboratory of Extreme-environmental Material Surfaces and Interfaces, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, People's Republic of China.
Flexible composite films with enhanced thermal conductivity were developed using aminated hexagonal boron nitride (BN-NH2). This innovation addresses heat dissipation in high-power radio-frequency (RF) electronics while maintaining transparency.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- High-power radio-frequency (RF) electronic devices require flexible, thermally conductive composite films for heat dissipation and signal integrity.
- Simultaneously optimizing thermal conductivity and minimizing signal loss in these films, especially at high filler loadings, is a significant challenge.
Purpose of the Study:
- To develop a flexible composite film with simultaneously high thermal conductivity and low dielectric loss for RF applications.
- To address the challenge of interfacial thermal transport limitations in filler-matrix composites.
Main Methods:
- A bottom-up strategy involving interface modification and spatial orientation of hexagonal boron nitride (BN) fillers.
- Surface modification of BN using amination (BN-NH2) to improve polymer matrix compatibility via electrostatic interactions.
- Fabrication of composite films with controlled BN filler arrangement.
Main Results:
- Achieved an exceptional in-plane thermal conductivity of 78.50 W m⁻¹ K⁻¹ in the composite film.
- The aminated BN (BN-NH2) enhanced interfacial thermal transport and compatibility with the polymer matrix.
- The oriented BN fillers preserved high electromagnetic wave transparency (99.94%) and improved breakdown strength.
Conclusions:
- Molecular-level filler modification and micro-nanostructural engineering are crucial for enhancing filler-matrix interfaces.
- The developed composite films offer a promising solution for thermal management in high-power RF electronic devices.
- Synergistic optimization of filler properties and arrangement leads to superior material performance.
