Metal-Semiconductor Junctions
Bonding in Metals
Metallic Solids
Types of Semiconductors
Biasing of Metal-Semiconductor Junctions
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Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
1Soft Machines Lab, Carnegie Mellon University, Pittsburgh, PA, USA. cmajidi@andrew.cmu.edu.
No abstract available in PubMed .