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Ultrasonic Soldering of AlN/Cu Using SiC-Modified Zn5Al3Ti Active Solder.
Tomas Melus1, Roman Kolenak1, Mikulas Sloboda1
1Faculty of Materials Science and Technology in Trnava, Slovak University of Technology in Bratislava, Jana Bottu n. 2781/25, 917 24 Trnava, Slovakia.
Adding silicon carbide (SiC) nanoparticles to Zn5Al3Ti active solder significantly enhances the mechanical properties of aluminum nitride (AlN) ceramic to copper (Cu) joints created via ultrasonic soldering. The optimized 6 wt.% SiC composite solder achieved a remarkable shear strength of 101 MPa.
Area of Science:
- Materials Science
- Metallurgy
- Nanotechnology
Background:
- Ultrasonic soldering is crucial for joining dissimilar materials like ceramics and metals.
- Zn5Al3Ti active solder is used for joining AlN ceramic to copper.
- Improving the mechanical strength and reliability of these joints is essential for advanced applications.
Purpose of the Study:
- To investigate the impact of silicon carbide (SiC) nanoparticle addition on Zn5Al3Ti active solder.
- To evaluate the effect of SiC on the microstructure and interfacial reactions of AlN/Cu joints.
- To determine the mechanical properties of composite solder joints under ultrasonic soldering conditions.
Main Methods:
- Preparation of Zn5Al3Ti composite solders with 3 and 6 wt.% SiC nanoparticles.
- Flux-free ultrasonic soldering of AlN ceramic to copper substrates.
- Evaluation of solder alloy tensile strength and joint shear strength.
- Microstructural and interfacial characterization using Scanning Electron Microscopy with Energy Dispersive Spectroscopy (SEM/EDS).
Main Results:
- SiC nanoparticle addition modified the Zn5Al3Ti solder microstructure.
- The AlN/Zn5Al3Ti + 6 wt.% SiC/Cu joint exhibited the highest shear strength, reaching approximately 101 MPa.
- SEM/EDS analysis revealed compact, multilayered interfacial regions with intermetallic phases and reaction products.
Conclusions:
- The addition of 6 wt.% SiC nanoparticles to Zn5Al3Ti solder significantly enhances the shear strength of AlN/Cu joints.
- Improved joint performance is attributed to SiC-induced microstructural changes and the formation of strong metallurgical bonds.
- Zn5Al3Ti solder with 6 wt.% SiC nanoparticles is a promising material for robust AlN/Cu ultrasonic soldering applications.
