You might also read
Articles linked to this work by shared authors, journal, and citation graph.
Updated: Jul 16, 2026

Multi-Modal Signals for Analyzing Pain Responses to Thermal and Electrical Stimuli
Published on: April 5, 2019
Aifeng Liu1,2,3, Longyao Zhang2,3, Enyan Xue2,3
1Tianjin International Joint Research Center for Neural Engineering, Academy of Medical Engineering and Translational Medicine, Medical School, Tianjin University, Tianjin, People's Republic of China.
Standardizing pain assessment is crucial. This review proposes a four-layer framework (subjective, behavioral, biosignal, integrated) to improve pain measurement across diverse patient populations and settings.
Area of Science:
Background:
Purpose of the Study:
Main Methods:
Main Results:
Conclusions: