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Packaging Design and Thermal Characterization of 3D Double-Sided Cooling Automotive SiC Power Modules with Reliable

Chunzhen Li1, Tianliang Lin1,2,3, Xinhua Guo1,4,5,6

  • 1College of Mechanical Engineering and Automation, Huaqiao University, Xiamen 361021, China.

Sensors (Basel, Switzerland)
|July 28, 2026
PubMed
Abstract

Keywords:
SiC power moduledouble-sided coolingjunction temperature sensingthermal analysisvertical chip stacking

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