Development and characterization of a chemically amplified positive-tone hybrid resist for thick-film...

This paper presents the design of a positive chemically amplified hybrid photoresist for thick-layer microfabrication. The formulation combines TBMA and MAPTMS to achieve acid-catalyzed deprotection for aqueous base solubility while providing mechanical robustness through sol-gel chemistry. Structural analyses (FTIR spectroscopy, ¹H, ¹³C, and ²⁹Si NMR) confirm controlled copolymerization and a limited degree of condensation, preserving Si-OH groups that enhance adhesion to glass substrates. Photolithographic tests demonstrate good uniformity and pattern resolution, despite a narrow process window caused by the competition between deprotection and condensation catalyzed by photoacids. These findings provide promising perspectives for applications in microfluidics and optoelectronics, with future work focusing on broadening process latitude and integrating advanced functionalities.