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Multispectral UV Imaging on Capacitive CMOS Arrays Enabled by Solution-Processed Metal-Oxide Nanoparticles
Suman Kundu1,2, Tao Shen1,2, Kai Betlem1,2
1Department of Microelectronics, Faculty of Electrical Engineering, Mathematics and Computer Science, TU Delft, Netherlands.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|July 31, 2026
Summary
This study introduces a novel ultraviolet (UV) imager using standard complementary metal-oxide-semiconductor (CMOS) technology. The new capacitive-based UV sensor offers selective detection and multispectral imaging capabilities, reducing fabrication costs for wider application.
Area of Science:
- Optoelectronics
- Semiconductor device physics
- Materials science
Background:
- Conventional ultraviolet (UV) imagers are expensive due to specialized semiconductor fabrication processes.
- Existing imagers often lack selectivity and multispectral capabilities for UV detection.
Purpose of the Study:
- To develop a cost-effective UV imager using standard complementary metal-oxide-semiconductor (CMOS) technology.
- To enable band-selective and multispectral UV detection with a novel capacitive sensing principle.
Main Methods:
- Fabrication of an imaging chip using standard 40 nm CMOS technology.
- Implementation of a capacitive operation principle utilizing a photodielectric effect in a functionalization layer.
- Use of solution-processed, wide-bandgap metal-oxide nanoparticles (ZnO, SnO2, Ga2O3) for the functionalization layer.
Main Results:
- Demonstration of UV detection via capacitance changes caused by UV light.
- Achieved band-selective detection across UV-A, UV-B, and UV-C spectral regions.
- Exhibited low noise-equivalent powers (17-138 fW Hz^-1/2) and inherent visible-blindness.
Conclusions:
- The capacitive-CMOS platform offers a route to reduced fabrication complexity for UV imagers.
- This technology enables selective and multispectral UV imaging.
- Potential for widespread implementation in consumer and specialized products.
