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Multiscale thermo-mechanical coupling in chip systems: a review
Le Li1, Weikun Huang2, Shihan Yan3
1School of Aerospace, Xi'an Jiaotong University, No.28, Xianning West Road, Xi'an, Xi'an, 710049, China.
Thermal management is crucial for chip reliability due to coupled heat and mechanical stress. Understanding multiscale thermomechanical interactions enables predictive thermal management for advanced chip systems.
Area of Science:
- Materials Science
- Mechanical Engineering
- Semiconductor Physics
Background:
- Increasing chip power density and integration necessitate advanced thermal management.
- Thermal management is intrinsically linked to mechanical reliability in modern chip systems.
- Multiscale thermomechanical coupling affects heat transport, structural integrity, and damage accumulation.
Purpose of the Study:
- To review progress in understanding multiscale thermomechanical coupling in chip systems.
- To outline factors influencing thermal transport and stress localization.
- To summarize strategies for thermal management and reliability enhancement.
Main Methods:
- Review of atomistic lattice dynamics and system-level heat-flow interactions.
- Analysis of microstructural heterogeneity, interfaces, and architectural complexity.
- Examination of degradation mechanisms and regulation strategies.
Main Results:
- Atom-level properties, microstructures, and system architecture significantly impact thermal transport and reliability.
- High-temperature operation induces coupled degradation phenomena like creep and delamination.
- Defect engineering, interface optimization, and advanced cooling are key regulation strategies.
Conclusions:
- Multiscale thermomechanical coupling is a critical consideration for next-generation chip systems.
- AI-assisted approaches show promise for materials screening, thermal prediction, and inverse design.
- Addressing key challenges is essential for predictive thermal management.
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