Multiscale thermo-mechanical coupling in chip systems: a review

Le Li1, Weikun Huang2, Shihan Yan3

  • 1School of Aerospace, Xi'an Jiaotong University, No.28, Xianning West Road, Xi'an, Xi'an, 710049, China.

Summary

Thermal management is crucial for chip reliability due to coupled heat and mechanical stress. Understanding multiscale thermomechanical interactions enables predictive thermal management for advanced chip systems.

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