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Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging

Chungen Hsu1, Chenlei Pang2, Qinghua Lu3

  • 1Specialty Polymers Research Center, Yongjiang Laboratory, Ningbo, Zhejiang315201, China.

ACS Applied Materials & Interfaces
|August 7, 2026
PubMed
Summary

No abstract available in PubMed .

Keywords:
advanced semiconductor packaginglow dielectric constantphotosensitive polyimideredistribution layerssignal integritythermal management

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