Scanning electron microscopic study and shear bond strength measurement with 5% and 37% phosphoric acid

Direct bonding of orthodontic attachments has become a clinical reality with the application of the acid etch technique, using 37% phosphoric acid. The objective of this study was to detect the etch pattern with scanning electron microscopy and the shear bond strength with a Hounsefield tensometer (Nene Instruments Ltd., Northampton, England) by using 37% and 5% phosphoric acid (H3PO4). It was observed that with 5% H3PO4 there was minimal enamel loss compared with 37% H3PO4. There was no significant difference in shear bond strength, when enamel surface was etched with 5% H3PO4 and 37% H3PO4.