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Phosphoric acid penetration during direct bonding
American Journal of Orthodontics
|November 1, 1976
Summary
Acid etching for dental bonding may penetrate deeper than stated. Rinsing doesn't fully stop the etching process in enamel, and no penetration was found at the dentinoenamel junction.
Area of Science:
- Dental Materials Science
- Adhesive Dentistry
- Surface Chemistry
Background:
- Effective enamel preparation is crucial for direct-bonding adhesive success.
- Understanding the depth and extent of acid etching is vital for predictable clinical outcomes.
Purpose of the Study:
- To investigate the actual penetration depth of acid etching material into enamel.
- To evaluate the influence of rinsing on the acid etching process.
- To determine if acid etching affects the dentinoenamel junction.
Main Methods:
- Microscopic analysis of acid-etched enamel surfaces.
- Evaluation of etching patterns at varying depths.
- Assessment of material penetration using specific imaging techniques.
Main Results:
- Rinsing failed to completely halt the acid etching process within the enamel depth.
- The effective depth of acid etching exceeded 10 micrometers, contradicting manufacturer claims.
- No evidence of acid etching material penetration was observed at the dentinoenamel junction.
Conclusions:
- The acid etching process in enamel preparation is more profound than often assumed.
- Clinical protocols may need adjustment based on the actual etching depth.
- The dentinoenamel junction appears resistant to acid etching penetration in this study.