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Sensors (Basel, Switzerland)|July 27, 2019
Effect of Imperfections Due to Material Heterogeneity on the Offset of Polysilicon MEMS StructuresAldo Ghisi, Stefano Mariani
Sensors (Basel, Switzerland)|March 6, 2012
Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale ApproachStefano Mariani, Aldo Ghisi, Alberto Corigliano, et al.
Sensors (Basel, Switzerland)|September 15, 2017
Multi-scale Analysis of MEMS Sensors Subject to Drop ImpactsStefano Mariani, Aldo Ghisi, Alberto Corigliano, et al.
Sensors (Basel, Switzerland)|December 4, 2012
Physically-based reduced order modelling of a uni-axial polysilicon MEMS accelerometerAldo Ghisi, Stefano Mariani, Alberto Corigliano, et al.
Sensors (Basel, Switzerland)|December 14, 2011
Two-scale simulation of drop-induced failure of polysilicon MEMS sensorsStefano Mariani, Aldo Ghisi, Alberto Corigliano, et al.
Micromachines|January 21, 2023
An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer BondingSeyed Amir Fouad Farshchi Yazdi, Matteo Garavaglia, Aldo Ghisi, et al.
Micromachines|April 3, 2021
A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded WaferSeyed Amir Fouad Farshchi Yazdi, Matteo Garavaglia, Aldo Ghisi, et al.
Micromachines|February 25, 2023
MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon StrengthTiago Vicentini Ferreira do Valle, Stefano Mariani, Aldo Ghisi, et al.
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