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Materials (Basel, Switzerland)|April 23, 2022
Glass Frit Jetting for Advanced Wafer-Level Hermetic PackagingAli Roshanghias, Jochen Bardong, Alfred BinderSensors (Basel, Switzerland)|July 25, 2019
Wireless Readout of Multiple SAW Temperature SensorsGudrun Bruckner, Jochen BardongIEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control|April 4, 2013
High-precision signal processing algorithm to evaluate SAW properties as a function of temperatureIsmail Shrena, David Eisele, Jochen Bardong, et al.IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control|March 15, 2014
Iridium interdigital transducers for high-temperature surface acoustic wave applicationsThierry Aubert, Jochen Bardong, Omar Elmazria, et al.Nanoscale|March 12, 2015
Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticlesAli Roshanghias, Andriy Yakymovych, Johannes Bernardi, et al.IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control|April 4, 2013
Experimental and theoretical investigations of some useful langasite cuts for high-temperature SAW applicationsJochen Bardong, Thierry Aubert, Natalya Naumenko, et al.Sensors (Basel, Switzerland)|April 29, 2020
Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw's MethodJohanna Zikulnig, Ali Roshanghias, Lukas Rauter, et al.The Journal of Physical Chemistry. C, Nanomaterials and Interfaces|February 16, 2016
Enthalpy Effect of Adding Cobalt to Liquid Sn-3.8Ag-0.7Cu Lead-Free Solder Alloy: Difference between Bulk and Nanosized CobaltAndriy Yakymovych, George Kaptay, Ali Roshanghias, et al.CALPHAD ; Computer Coupling of Phase Diagrams and Thermochemistry|June 18, 2015
Sn-Ag-Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary systemAli Roshanghias, Jan Vrestal, Andriy Yakymovych, et al.Journal of Visualized Experiments : Jove|February 19, 2019
Hybrid Printing for the Fabrication of Smart SensorsLisa-Marie Faller, Johanna Zikulnig, Matic Krivec, et al.Pageof 3