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Materials (Basel, Switzerland)|May 10, 2019
High Throughput Direct Laser Interferential Patterning of Aluminum for Fabrication of Super Hydrophobic SurfacesValentin Lang, Bogdan Voisiat, Andrés Fabián LasagniScientific Reports|May 26, 2019
Improving the homogeneity of diffraction based colours by fabricating periodic patterns with gradient spatial period using Direct Laser Interference PatterningBogdan Voisiat, Wei Wang, Max Holzhey, et al.Plos One|February 27, 2023
Numerical simulation of periodic surface structures created by direct laser interference patterningMartin Heinrich, Bogdan Voisiat, Andrés Fabián Lasagni, et al.Micromachines|May 28, 2022
Efficient Water-Assisted Glass Cutting with 355 nm Picosecond Laser PulsesEdgaras Markauskas, Laimis Zubauskas, Bogdan Voisiat, et al.Materials (Basel, Switzerland)|January 21, 2022
Utilizing a Diffractive Focus Beam Shaper to Enhance Pattern Uniformity and Process Throughput during Direct Laser Interference PatterningMikhael El-Khoury, Bogdan Voisiat, Tim Kunze, et al.Scientific Reports|September 28, 2019
Fabrication of superhydrophobic and ice-repellent surfaces on pure aluminium using single and multiscaled periodic texturesStephan Milles, Marcos Soldera, Bogdan Voisiat, et al.Scientific Reports|April 26, 2024
Diffraction-based approach for real-time monitoring of nanosecond direct laser interference patterning structure formation on stainless steelIgnacio Tabares, Marcos Soldera, Bogdan Voisiat, et al.Materials (Basel, Switzerland)|December 22, 2019
Development of a Monitoring Strategy for Laser-Textured Metallic Surfaces Using a Diffractive ApproachSascha Teutoburg-Weiss, Bogdan Voisiat, Marcos Soldera, et al.Materials (Basel, Switzerland)|September 18, 2020
Prediction of Optimum Process Parameters Fabricated by Direct Laser Interference Patterning Based on Central Composite DesignMikhael El-Khoury, Bogdan Voisiat, Tim Kunze, et al.Materials (Basel, Switzerland)|October 23, 2019
Picosecond Laser Interference Patterning of Periodical Micro-Architectures on Metallic Molds for Hot EmbossingYangxi Fu, Marcos Soldera, Wei Wang, et al.Pageof 2