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Microsystems & Nanoengineering|October 28, 2025
A contamination-free and low-leakage-current Cu-TSV technology enabled by engineered double-sided processingYigang Hao, Yingtao Ding, Ziyue Zhang, et al.
Optics Letters|December 1, 2025
Two-axis electromagnetic fast steering MEMS micromirror with a 10-mm-large aperture for satellite communicationsMenglin Chen, Chenyao Zhu, Yingchao Cao, et al.
Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems|May 9, 2022
Development of Dual-Frequency PMUT Arrays Based on Thin Ceramic PZT for Endoscopic Photoacoustic ImagingHaoran Wang, Hao Yang, Zhenfang Chen, et al.
Microsystems & Nanoengineering|June 12, 2024
An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layersYuwen Su, Yingtao Ding, Lei Xiao, et al.
Microsystems & Nanoengineering|September 1, 2023
A robust lateral shift free (LSF) electrothermal micromirror with flexible multimorph beamsHengzhang Yang, Anrun Ren, Yingtao Ding, et al.
Microsystems & Nanoengineering|September 4, 2025
SPL and THD improvement of a cantilever-diaphragm piezoelectric MEMS loudspeaker with Double-S actuatorsQincheng Zheng, Ke Cao, Xudong Ma, et al.
Microsystems & Nanoengineering|January 22, 2025
Theoretical and experimental investigations of the CMOS compatible Pirani gauges with a temperature compensation modelShizhen Xu, Gai Yang, Junfu Chen, et al.
Micromachines|July 27, 2024
Temperature Compensation for MEMS Accelerometer Based on a Fusion AlgorithmYangyanhao Guo, Zihan Zhang, Longkang Chang, et al.
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