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Materials (Basel, Switzerland)|February 25, 2022
Development of Ag-In Alloy Pastes by Mechanical Alloying for Die Attachment of High-Power Semiconductor DevicesChin-Hao Tsai, Wei-Chen Huang, Chengheng Robert KaoMaterials (Basel, Switzerland)|September 28, 2023
Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu SubstrateHan-Tang Hung, Fu-Ling Chang, Chin-Hao Tsai, et al.Pageof 1