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David Bušek

Showing results (1-10 of 9) with videos related to

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Materials (Basel, Switzerland)|June 19, 2024
A Novel Approach for Temperature-Induced Ball Grid Array Collapse ObservationKristina Sorokina, Karel Dušek, David Bušek
Polymers|December 10, 2021
Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing ProcessTomáš Tichý, Ondřej Šefl, Petr Veselý, et al.
Materials (Basel, Switzerland)|February 27, 2020
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSbAgata Skwarek, Balázs Illés, Tamás Hurtony, et al.
Materials (Basel, Switzerland)|November 25, 2020
Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling RatesTamás Hurtony, Oliver Krammer, Balázs Illés, et al.
Materials (Basel, Switzerland)|November 6, 2019
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-FilmsBalázs Illés, Tamás Hurtony, Olivér Krammer, et al.
Materials (Basel, Switzerland)|February 11, 2023
Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during PandemicAttila Géczy, Gergő Havellant, Réka Bátorfi, et al.
The Review of Scientific Instruments|July 2, 2018
Measurement of doping profiles by a contactless method of IR reflectance under grazing incidenceJakub Holovský, Zdeněk Remeš, Aleš Poruba, et al.
Materials (Basel, Switzerland)|December 24, 2021
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder JointsKarel Dušek, Petr Veselý, David Bušek, et al.
Nanomaterials (Basel, Switzerland)|October 25, 2024
Effects of ZrO<sub>2</sub> Nano-Particles' Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical StudyAgata Skwarek, Halim Choi, Tamás Hurtony, et al.
Pageof 1

Showing results (1-10 of 9) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|June 19, 2024
A Novel Approach for Temperature-Induced Ball Grid Array Collapse ObservationKristina Sorokina, Karel Dušek, David Bušek
Polymers|December 10, 2021
Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing ProcessTomáš Tichý, Ondřej Šefl, Petr Veselý, et al.
Materials (Basel, Switzerland)|February 27, 2020
Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn-0.7Cu wt. % Solder Alloy Inoculated with InSbAgata Skwarek, Balázs Illés, Tamás Hurtony, et al.
Materials (Basel, Switzerland)|November 25, 2020
Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling RatesTamás Hurtony, Oliver Krammer, Balázs Illés, et al.
Materials (Basel, Switzerland)|November 6, 2019
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-FilmsBalázs Illés, Tamás Hurtony, Olivér Krammer, et al.
Materials (Basel, Switzerland)|February 11, 2023
Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during PandemicAttila Géczy, Gergő Havellant, Réka Bátorfi, et al.
The Review of Scientific Instruments|July 2, 2018
Measurement of doping profiles by a contactless method of IR reflectance under grazing incidenceJakub Holovský, Zdeněk Remeš, Aleš Poruba, et al.
Materials (Basel, Switzerland)|December 24, 2021
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder JointsKarel Dušek, Petr Veselý, David Bušek, et al.
Nanomaterials (Basel, Switzerland)|October 25, 2024
Effects of ZrO<sub>2</sub> Nano-Particles' Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical StudyAgata Skwarek, Halim Choi, Tamás Hurtony, et al.
Pageof 1