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Scientific Reports
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January 26, 2019
Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devices
Jinseok Choi, Gab Soo Choi, Sung Jin An
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Search research articles
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Showing results (1-10 of 1) with videos related to
Sort By:
Page
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Scientific Reports
|
January 26, 2019
Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devices
Jinseok Choi, Gab Soo Choi, Sung Jin An
Page
of 1