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Gab Soo Choi

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Scientific Reports|January 26, 2019
Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devicesJinseok Choi, Gab Soo Choi, Sung Jin An
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Scientific Reports|January 26, 2019
Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devicesJinseok Choi, Gab Soo Choi, Sung Jin An
Pageof 1