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ACS Applied Materials & Interfaces|June 15, 2026
Surface-Modified InVGr as a Thermal Interface Material with High Thermal Conductivity and Low Contact Thermal ResistanceYisimayili Tuersun, Wenmei Luo, Junfeng Zhao, et al.
Chaos (Woodbury, N.Y.)|October 2, 2012
Reverse engineering of complex dynamical networks in the presence of time-delayed interactions based on noisy time seriesWen-Xu Wang, Jie Ren, Ying-Cheng Lai, et al.
Physical Review Letters|March 4, 2014
Anomalous heat diffusionSha Liu, Peter Hänggi, Nianbei Li, et al.
Iscience|February 12, 2025
Feature analysis aided design of lightweight heat sink from network structuresTianlin Luo, Changliang Zhu, Baowen Li, et al.
Physical Review Letters|April 7, 2010
Noise bridges dynamical correlation and topology in coupled oscillator networksJie Ren, Wen-Xu Wang, Baowen Li, et al.
Small (Weinheim an Der Bergstrasse, Germany)|October 4, 2024
3D Network of Liquid Metal-Embedded Graphene via Surface Coating for Flexible Thermal ManagementWenmei Luo, Baojie Wei, Tianlin Luo, et al.
Physical Review. E, Statistical, Nonlinear, and Soft Matter Physics|March 19, 2013
Classical heat transport in anharmonic molecular junctions: exact solutionsSha Liu, Bijay Kumar Agarwalla, Jian-Sheng Wang, et al.
Advanced Materials (Deerfield Beach, Fla.)|October 12, 2018
Probing the Physical Origin of Anisotropic Thermal Transport in Black Phosphorus NanoribbonsYunshan Zhao, Gang Zhang, Mui Hoon Nai, et al.
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