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Scientific Reports
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April 29, 2026
Physiological and psychological effects of Wagyu beef taste stimulation: a randomized crossover trial
Harumi Ikei, Hyunju Jo, Hideki Hirano, et al.
Micromachines
|
November 15, 2018
Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames
Koki Tanaka, Hideki Hirano, Masafumi Kumano, et al.
Journal of Physiological Anthropology
|
April 17, 2007
Physiological effects of Shinrin-yoku (taking in the atmosphere of the forest) in an old-growth broadleaf forest in Yamagata Prefecture, Japan
Yuko Tsunetsugu, Bum-Jin Park, Hideki Ishii, et al.
Journal of Physiological Anthropology
|
April 17, 2007
Physiological effects of Shinrin-yoku (taking in the atmosphere of the forest)--using salivary cortisol and cerebral activity as indicators
Bum-Jin Park, Yuko Tsunetsugu, Tamami Kasetani, et al.
Micromachines
|
November 9, 2018
Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding
Koki Tanaka, Wei-Shan Wang, Mario Baum, et al.
Page
of 1
Search research articles
Search
Showing results (1-10 of 5) with videos related to
Sort By:
Page
of 1
Scientific Reports
|
April 29, 2026
Physiological and psychological effects of Wagyu beef taste stimulation: a randomized crossover trial
Harumi Ikei, Hyunju Jo, Hideki Hirano, et al.
Micromachines
|
November 15, 2018
Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames
Koki Tanaka, Hideki Hirano, Masafumi Kumano, et al.
Journal of Physiological Anthropology
|
April 17, 2007
Physiological effects of Shinrin-yoku (taking in the atmosphere of the forest) in an old-growth broadleaf forest in Yamagata Prefecture, Japan
Yuko Tsunetsugu, Bum-Jin Park, Hideki Ishii, et al.
Journal of Physiological Anthropology
|
April 17, 2007
Physiological effects of Shinrin-yoku (taking in the atmosphere of the forest)--using salivary cortisol and cerebral activity as indicators
Bum-Jin Park, Yuko Tsunetsugu, Tamami Kasetani, et al.
Micromachines
|
November 9, 2018
Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding
Koki Tanaka, Wei-Shan Wang, Mario Baum, et al.
Page
of 1