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Materials (Basel, Switzerland)|December 9, 2023
Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic PackagingHsien-Chie Cheng, Wen-You JhuScience Progress|December 1, 2025
A hierarchical sub-modeling approach for the thermo-mechanical analysis of a TFT-FOPLPHsien-Chie Cheng, Ching-Feng YuMaterials (Basel, Switzerland)|September 28, 2021
Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load CyclesHsien-Chie Cheng, Siang-Yu Lin, Yan-Cheng LiuMicromachines|July 29, 2023
Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter OptimizationHsien-Chie Cheng, Chia-Lin Ma, Yang-Lun LiuMaterials (Basel, Switzerland)|September 10, 2021
Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during FabricationHsien-Chie Cheng, Ling-Ching Tai, Yan-Cheng LiuJournal of Nanoscience and Nanotechnology|September 29, 2015
Structural Optimizations of Silicon Based NMOSFETs with a Sunken STI Pattern by Using a Robust Stress Simulation MethodologyChang-Chun Lee, Chuan-Hsi Liu, Hsien-Chie Cheng, et al.Micromachines|July 29, 2023
Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor ApplicationsHsien-Chie Cheng, Yan-Cheng Liu, Hsin-Han Lin, et al.Micromachines|March 6, 2025
Dynamic Performance Evaluation of Bidirectional Bridgeless Interleaved Totem-Pole Power Factor Correction Boost ConverterHsien-Chie Cheng, Wen-You Jhu, Yu-Cheng Liu, et al.Scientific Reports|March 15, 2026
Effects of parasitic capacitance on switching transients and thermal performance in a single-phase SiC power MOSFET inverterHsien-Chie Cheng, Wen-You Jhu, Yan-Cheng Liu, et al.Pageof 1