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Juan S Ordonez

Showing results (1-10 of 20) with videos related to

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Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 24, 2009
Scaling limitations of laser-fabricated nerve electrode arraysChristian Henle, Martin Schuettler, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 19, 2012
Ensuring minimal humidity levels in hermetic implant housingsMartin Schuettler, Andreas Schatz, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|February 1, 2013
Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communicationMartin Schuettler, Fabian Kohler, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|February 1, 2013
Improved polyimide thin-film electrodes for neural implantsJuan S Ordonez, Christian Boehler, Martin Schuettler, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|February 1, 2013
A 232-channel retinal vision prosthesis with a miniaturized hermetic packageJuan S Ordonez, Martin Schuettler, Maurits Ortmanns, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|November 17, 2018
PDMS Gasket Underfill for Long-Term Insulation of High-Density Interconnections in Active Implantable Medical DevicesSharif Khan, Daniel Scholz, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 7, 2016
Development of a multichannel implantable connectorJulia Koch, Juan S Ordonez, Thomas Stieglitz, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 9, 2015
A polymer-metal two step sealing concept for hermetic neural implant packagesFabian Kohler, Patrick Kiele, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|November 25, 2010
A device for vacuum drying, inert gas backfilling and solder sealing of hermetic implant packagesMartin Schuettler, Matthias Huegle, Juan S Ordonez, et al.
Sensors (Basel, Switzerland)|January 3, 2017
Concept and Development of an Electronic Framework Intended for Electrode and Surrounding Environment Characterization In VivoStefan B Rieger, Jennifer Pfau, Thomas Stieglitz, et al.
Pageof 2

Showing results (1-10 of 20) with videos related to

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Pageof 2
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 24, 2009
Scaling limitations of laser-fabricated nerve electrode arraysChristian Henle, Martin Schuettler, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 19, 2012
Ensuring minimal humidity levels in hermetic implant housingsMartin Schuettler, Andreas Schatz, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|February 1, 2013
Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communicationMartin Schuettler, Fabian Kohler, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|February 1, 2013
Improved polyimide thin-film electrodes for neural implantsJuan S Ordonez, Christian Boehler, Martin Schuettler, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|February 1, 2013
A 232-channel retinal vision prosthesis with a miniaturized hermetic packageJuan S Ordonez, Martin Schuettler, Maurits Ortmanns, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|November 17, 2018
PDMS Gasket Underfill for Long-Term Insulation of High-Density Interconnections in Active Implantable Medical DevicesSharif Khan, Daniel Scholz, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 7, 2016
Development of a multichannel implantable connectorJulia Koch, Juan S Ordonez, Thomas Stieglitz, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|January 9, 2015
A polymer-metal two step sealing concept for hermetic neural implant packagesFabian Kohler, Patrick Kiele, Juan S Ordonez, et al.
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference|November 25, 2010
A device for vacuum drying, inert gas backfilling and solder sealing of hermetic implant packagesMartin Schuettler, Matthias Huegle, Juan S Ordonez, et al.
Sensors (Basel, Switzerland)|January 3, 2017
Concept and Development of an Electronic Framework Intended for Electrode and Surrounding Environment Characterization In VivoStefan B Rieger, Jennifer Pfau, Thomas Stieglitz, et al.
Pageof 2