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Journal of Nanoscience and Nanotechnology|June 25, 2008
Direct alpha Ta formation on TaN by resputtering for low resistive diffusion barriersJung-Chih Tsao, Chuan-Pu Liu, Ying-Lang Wang, et al.Journal of Nanoscience and Nanotechnology|May 16, 2009
Study of nitrogen diffusion profile of low resistivity diffusion barrier by resputtering technologyJung-Chih Tsao, Chuan-Pu Liu, Ying-Lang Wang, et al.Journal of Nanoscience and Nanotechnology|June 25, 2008
The integration solution of copper barrier deposition for nanometer interconnect processKei-Wei Chen, Ying-Lang Wang, Jung-Chih Tsao, et al.Journal of Nanoscience and Nanotechnology|December 9, 2010
Microstructure and formation of copper oxide in the Cu electro-polishing processTe-Ming Kung, Michael Rong-Shie Huang, Jung-Chih Tsao, et al.Pageof 1