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Junyou Yang

Showing results (31-40 of 48) with videos related to

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Journal of the American Chemical Society|August 19, 2021
Cubic AgMnSbTe<sub>3</sub> Semiconductor with a High Thermoelectric PerformanceYubo Luo, Tian Xu, Zheng Ma, et al.
Small (Weinheim an Der Bergstrasse, Germany)|October 13, 2022
Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame RetardancyYongxin Qian, Yubo Luo, Abubakar Yakubu Haruna, et al.
The Review of Scientific Instruments|January 3, 2017
A new method for simultaneous measurement of Seebeck coefficient and resistivityXu He, Junyou Yang, Qinghui Jiang, et al.
ACS Applied Materials & Interfaces|August 16, 2024
Enhancing Thermoelectric and Cooling Performance of Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> through Ferroelectric Polarization in Flexible Ag/PZT/PVDF/Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> FilmChengjun Li, Wang Li, Chengwei Sun, et al.
Small (Weinheim an Der Bergstrasse, Germany)|April 7, 2026
Multifunctional 3D MXene@MDCF Nanoarchitectures via Hierarchical Networks Self-Assembled Strategy Achieving Superior Electromagnetic Wave Absorption and Flame Retardancy with Enhanced Thermal ManagementHao He, Luyao Wang, Yongxin Qian, et al.
Exploration (Beijing, China)|June 30, 2025
Recent Advancements in Ambient-Air Fabrication of Perovskite Solar CellsYihuai Huang, Wenguang Zhang, Yuchen Xiong, et al.
Small (Weinheim an Der Bergstrasse, Germany)|September 12, 2023
MXene-Layered Double Hydroxide Reinforced Epoxy Nanocomposite with Enhanced Electromagnetic Wave Absorption, Thermal Conductivity, and Flame Retardancy in Electronic PackagingLuyao Wang, Xin Li, Yongxin Qian, et al.
Small (Weinheim an Der Bergstrasse, Germany)|May 13, 2023
Toward Ultrahigh Thermoelectric Performance of Cu<sub>2</sub> SnS<sub>3</sub> -Based Materials by Analog AlloyingWang Li, Yubo Luo, Tian Xu, et al.
ACS Applied Materials & Interfaces|August 10, 2017
Combination of Carrier Concentration Regulation and High Band Degeneracy for Enhanced Thermoelectric Performance of Cu<sub>3</sub>SbSe<sub>4</sub>Dan Zhang, Junyou Yang, Qinghui Jiang, et al.
Journal of the American Chemical Society|January 14, 2022
Thermoelectric Performance of the 2D Bi<sub>2</sub>Si<sub>2</sub>Te<sub>6</sub> SemiconductorYubo Luo, Zheng Ma, Shiqiang Hao, et al.
Pageof 5

Showing results (31-40 of 48) with videos related to

Sort By:
Pageof 5
Journal of the American Chemical Society|August 19, 2021
Cubic AgMnSbTe<sub>3</sub> Semiconductor with a High Thermoelectric PerformanceYubo Luo, Tian Xu, Zheng Ma, et al.
Small (Weinheim an Der Bergstrasse, Germany)|October 13, 2022
Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame RetardancyYongxin Qian, Yubo Luo, Abubakar Yakubu Haruna, et al.
The Review of Scientific Instruments|January 3, 2017
A new method for simultaneous measurement of Seebeck coefficient and resistivityXu He, Junyou Yang, Qinghui Jiang, et al.
ACS Applied Materials & Interfaces|August 16, 2024
Enhancing Thermoelectric and Cooling Performance of Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> through Ferroelectric Polarization in Flexible Ag/PZT/PVDF/Bi<sub>0.5</sub>Sb<sub>1.5</sub>Te<sub>3</sub> FilmChengjun Li, Wang Li, Chengwei Sun, et al.
Small (Weinheim an Der Bergstrasse, Germany)|April 7, 2026
Multifunctional 3D MXene@MDCF Nanoarchitectures via Hierarchical Networks Self-Assembled Strategy Achieving Superior Electromagnetic Wave Absorption and Flame Retardancy with Enhanced Thermal ManagementHao He, Luyao Wang, Yongxin Qian, et al.
Exploration (Beijing, China)|June 30, 2025
Recent Advancements in Ambient-Air Fabrication of Perovskite Solar CellsYihuai Huang, Wenguang Zhang, Yuchen Xiong, et al.
Small (Weinheim an Der Bergstrasse, Germany)|September 12, 2023
MXene-Layered Double Hydroxide Reinforced Epoxy Nanocomposite with Enhanced Electromagnetic Wave Absorption, Thermal Conductivity, and Flame Retardancy in Electronic PackagingLuyao Wang, Xin Li, Yongxin Qian, et al.
Small (Weinheim an Der Bergstrasse, Germany)|May 13, 2023
Toward Ultrahigh Thermoelectric Performance of Cu<sub>2</sub> SnS<sub>3</sub> -Based Materials by Analog AlloyingWang Li, Yubo Luo, Tian Xu, et al.
ACS Applied Materials & Interfaces|August 10, 2017
Combination of Carrier Concentration Regulation and High Band Degeneracy for Enhanced Thermoelectric Performance of Cu<sub>3</sub>SbSe<sub>4</sub>Dan Zhang, Junyou Yang, Qinghui Jiang, et al.
Journal of the American Chemical Society|January 14, 2022
Thermoelectric Performance of the 2D Bi<sub>2</sub>Si<sub>2</sub>Te<sub>6</sub> SemiconductorYubo Luo, Zheng Ma, Shiqiang Hao, et al.
Pageof 5