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Micromachines|June 28, 2023
Fixed-Diamond Abrasive Wire-Saw Cutting Force Modeling Based on Changes in Contact Arc LengthsLie Liang, Shujuan Li, Kehao Lan, et al.
Materials (Basel, Switzerland)|May 27, 2023
Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer SurfaceLie Liang, Shujuan Li, Kehao Lan, et al.
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