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Micromachines|July 8, 2023
Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic PackagingJun Cao, Junchao Zhang, Baoan Wu, et al.Nature Communications|March 6, 2026
Upwind electromigration of sub-10-nm metallic nano-interconnectsYouran Hong, Tianqi Deng, Xiyao Li, et al.Springerplus|June 28, 2016
Dynamic recrystallization behavior and processing map of the Cu-Cr-Zr-Nd alloyYi Zhang, Huili Sun, Alex A Volinsky, et al.Journal of Colloid and Interface Science|October 10, 2025
Precise CuO bond length engineering via alkaline-earth modulation breaks activity-stability trade-off in CO<sub>2</sub>-to-ethylene electrocatalysisChangrui Shi, Hao Hu, Bo Zhao, et al.Langmuir : the ACS Journal of Surfaces and Colloids|January 7, 2026
Unlocking Superior Mechanical Performance in Electrolytic Copper Foils Through Synergistic Competitive AdditivesHao Hu, Shuaiyu Ma, Kexing Song, et al.Small (Weinheim an Der Bergstrasse, Germany)|October 11, 2024
Dislocation Evolution in Cyclic-Loaded Cu Nanopillars with Different ConfigurationsXiyao Li, Zhiyu Zhao, Zhenghao Zhang, et al.Journal of Colloid and Interface Science|March 29, 2024
Heterojunction tunnelled vanadium-based cathode materials for high-performance aqueous zinc ion batteriesHao Hu, Pengbo Zhao, Xuerong Li, et al.Micromachines|August 27, 2021
Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy WireJun Cao, Junchao Zhang, Baoan Wu, et al.Journal of Colloid and Interface Science|August 9, 2024
Empowering lithium-ion storage: unveiling the superior performance of niobium-based oxide/perovskite heterojunction with built-in electric fieldYongkang Chen, Haoyan Cheng, Ruohan Liu, et al.Materials (Basel, Switzerland)|July 26, 2020
Microstructure Evolution in Cu-Ni-Co-Si-Cr Alloy During Hot Compression by Ce AdditionYijie Ban, Yi Zhang, Baohong Tian, et al.Pageof 4