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Journal of Nanoscience and Nanotechnology|April 28, 2019
Electrochemical Polishing of Cu Redistribution Layers for Fan-Out Wafer Level PackagingKimoon Park, Jinhyun Lee, Bongyoung YooFrontiers in Chemistry|November 8, 2021
Study of Cu Electrochemical Polishing Mechanism With Observation of Water Acceptor DiffusionKimoon Park, Jinhyun Lee, Youjung Kim, et al.Journal of Microbiology and Biotechnology|June 5, 2009
Fermentation of rice bran and defatted rice bran for butanol 5 production using clostridium beijerinckii NCIMB 8052Jieun Lee, Eunjong Seo, Dae-Hyuk Kweon, et al.Korean Journal for Food Science of Animal Resources|January 14, 2016
Effects of Egg Shell Membrane Hydrolysates on Anti-Inflammatory, Anti-Wrinkle, Anti-Microbial Activity and Moisture-ProtectionJinhee Yoo, Kimoon Park, Youngji Yoo, et al.Frontiers in Chemistry|November 16, 2020
Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)Youjung Kim, Sanghyun Jin, Kimoon Park, et al.Phytotherapy Research : PTR|May 21, 2014
Evaluation of anti-atopic dermatitis activity of Hypsizigus marmoreus extractTaeHo Kim, KiMoon Park, Hye Sun Jung, et al.Pageof 1