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King-Ning Tu

Showing results (1-10 of 22) with videos related to

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Journal of the American Chemical Society|November 23, 2006
Preparation of hierarchically porous nickel from macroporous siliconXi Zhang, King-Ning Tu
Materials (Basel, Switzerland)|March 19, 2020
Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain StructuresYu-Jin Li, King-Ning Tu, Chih Chen
Materials (Basel, Switzerland)|March 19, 2020
Tensile Properties and Thermal Stability of Unidirectionally <111>-Oriented Nanotwinned and <110>-Oriented Microtwinned CopperYu-Jin Li, King-Ning Tu, Chih Chen
Science and Technology of Advanced Materials|October 24, 2017
Intermetallic compounds in 3D integrated circuits technology: a brief reviewSyahira Annuar, Reza Mahmoodian, Mohd Hamdi, et al.
Nano Letters|August 16, 2022
Uphill Diffusion Induced Point Contact Reaction in Si NanowiresYi-Chia Chou, Lih-Juann Chen, King-Ning Tu
Nanomaterials (Basel, Switzerland)|February 25, 2025
A Comparison Between Ripening Under a Constant Volume and Ripening Under a Constant Surface AreaKing-Ning Tu, Andriy M Gusak, Qinglei Sun, et al.
Nano Letters|May 21, 2009
Homogeneous nucleation of epitaxial CoSi2 and NiSi in Si nanowiresYi-Chia Chou, Wen-Wei Wu, Lih-Juann Chen, et al.
Physical Review Letters|September 28, 2010
Inhibiting Adatom diffusion through surface alloyingZhengzheng Chen, Nicholas Kioussis, King-Ning Tu, et al.
Materials (Basel, Switzerland)|September 8, 2017
Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated CircuitsXi Zhang, Chengkun Xu, Kyuchul Chong, et al.
Nano Letters|June 27, 2012
Ultrashort channel silicon nanowire transistors with nickel silicide source/drain contactsWei Tang, Shadi A Dayeh, S Tom Picraux, et al.
Pageof 3

Showing results (1-10 of 22) with videos related to

Sort By:
Pageof 3
Journal of the American Chemical Society|November 23, 2006
Preparation of hierarchically porous nickel from macroporous siliconXi Zhang, King-Ning Tu
Materials (Basel, Switzerland)|March 19, 2020
Tensile Properties of <111>-Oriented Nanotwinned Cu with Different Columnar Grain StructuresYu-Jin Li, King-Ning Tu, Chih Chen
Materials (Basel, Switzerland)|March 19, 2020
Tensile Properties and Thermal Stability of Unidirectionally <111>-Oriented Nanotwinned and <110>-Oriented Microtwinned CopperYu-Jin Li, King-Ning Tu, Chih Chen
Science and Technology of Advanced Materials|October 24, 2017
Intermetallic compounds in 3D integrated circuits technology: a brief reviewSyahira Annuar, Reza Mahmoodian, Mohd Hamdi, et al.
Nano Letters|August 16, 2022
Uphill Diffusion Induced Point Contact Reaction in Si NanowiresYi-Chia Chou, Lih-Juann Chen, King-Ning Tu
Nanomaterials (Basel, Switzerland)|February 25, 2025
A Comparison Between Ripening Under a Constant Volume and Ripening Under a Constant Surface AreaKing-Ning Tu, Andriy M Gusak, Qinglei Sun, et al.
Nano Letters|May 21, 2009
Homogeneous nucleation of epitaxial CoSi2 and NiSi in Si nanowiresYi-Chia Chou, Wen-Wei Wu, Lih-Juann Chen, et al.
Physical Review Letters|September 28, 2010
Inhibiting Adatom diffusion through surface alloyingZhengzheng Chen, Nicholas Kioussis, King-Ning Tu, et al.
Materials (Basel, Switzerland)|September 8, 2017
Study of Ni Metallization in Macroporous Si Using Wet Chemistry for Radio Frequency Cross-Talk Isolation in Mixed Signal Integrated CircuitsXi Zhang, Chengkun Xu, Kyuchul Chong, et al.
Nano Letters|June 27, 2012
Ultrashort channel silicon nanowire transistors with nickel silicide source/drain contactsWei Tang, Shadi A Dayeh, S Tom Picraux, et al.
Pageof 3