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Kuo Hao Tseng

Showing results (1-10 of 5) with videos related to

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Journal of Electronic Packaging|May 26, 2016
A Study on Electrical Reliability Criterion on Through Silicon Via PackagingBen-Je Lwo, Kuo-Hao Tseng, Kun-Fu Tseng
Phlebology|April 22, 2017
Comparison of piezoresistive sensor to PicoPress® in in-vitro interface pressure measurementYung-Wei Chi, Kuo-Hao Tseng, Ruya Li, et al.
Phlebology|June 26, 2019
Effect of subsurface pressure on the interface pressure measurement in an in vitro experimentYung-Wei Chi, Ray Lin, Kuo-Hao Tseng, et al.
Biomicrofluidics|June 5, 2018
Dotette: Programmable, high-precision, plug-and-play droplet pipettingJinzhen Fan, Yongfan Men, Kuo Hao Tseng, et al.
Lab on a Chip|June 15, 2017
Multi-dimensional studies of synthetic genetic promoters enabled by microfluidic impact printingJinzhen Fan, Fernando Villarreal, Brent Weyers, et al.
Pageof 1

Showing results (1-10 of 5) with videos related to

Sort By:
Pageof 1
Journal of Electronic Packaging|May 26, 2016
A Study on Electrical Reliability Criterion on Through Silicon Via PackagingBen-Je Lwo, Kuo-Hao Tseng, Kun-Fu Tseng
Phlebology|April 22, 2017
Comparison of piezoresistive sensor to PicoPress® in in-vitro interface pressure measurementYung-Wei Chi, Kuo-Hao Tseng, Ruya Li, et al.
Phlebology|June 26, 2019
Effect of subsurface pressure on the interface pressure measurement in an in vitro experimentYung-Wei Chi, Ray Lin, Kuo-Hao Tseng, et al.
Biomicrofluidics|June 5, 2018
Dotette: Programmable, high-precision, plug-and-play droplet pipettingJinzhen Fan, Yongfan Men, Kuo Hao Tseng, et al.
Lab on a Chip|June 15, 2017
Multi-dimensional studies of synthetic genetic promoters enabled by microfluidic impact printingJinzhen Fan, Fernando Villarreal, Brent Weyers, et al.
Pageof 1