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Kuo-Ning Chiang

Showing results (1-10 of 7) with videos related to

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Materials (Basel, Switzerland)|September 13, 2025
Multi-Algorithm Ensemble Learning Framework for Predicting the Solder Joint Reliability of Wafer-Level PackagingQinghua Su, Kuo-Ning Chiang
Materials (Basel, Switzerland)|June 10, 2022
Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning AlgorithmsQing-Hua Su, Kuo-Ning Chiang
Materials (Basel, Switzerland)|July 29, 2023
Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural NetworksCadmus Yuan, Qinghua Su, Kuo-Ning Chiang
Materials (Basel, Switzerland)|August 29, 2024
A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced PackagingQinghua Su, Cadmus Yuan, Kuo-Ning Chiang
Micromachines|April 3, 2021
Reliability Evaluation of Fan-Out Type 3D Packaging-On-PackagingPao-Hsiung Wang, Yu-Wei Huang, Kuo-Ning Chiang
Materials (Basel, Switzerland)|September 28, 2021
An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced PackagingSunil Kumar Panigrahy, Yi-Chieh Tseng, Bo-Ruei Lai, et al.
Chemphyschem : a European Journal of Chemical Physics and Physical Chemistry|October 2, 2009
Determining the zero-force binding energetics of an intercalated DNA complex by a single-molecule approachTzu-Sen Yang, Yujia Cui, Chien-Ming Wu, et al.
Pageof 1

Showing results (1-10 of 7) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|September 13, 2025
Multi-Algorithm Ensemble Learning Framework for Predicting the Solder Joint Reliability of Wafer-Level PackagingQinghua Su, Kuo-Ning Chiang
Materials (Basel, Switzerland)|June 10, 2022
Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning AlgorithmsQing-Hua Su, Kuo-Ning Chiang
Materials (Basel, Switzerland)|July 29, 2023
Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural NetworksCadmus Yuan, Qinghua Su, Kuo-Ning Chiang
Materials (Basel, Switzerland)|August 29, 2024
A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced PackagingQinghua Su, Cadmus Yuan, Kuo-Ning Chiang
Micromachines|April 3, 2021
Reliability Evaluation of Fan-Out Type 3D Packaging-On-PackagingPao-Hsiung Wang, Yu-Wei Huang, Kuo-Ning Chiang
Materials (Basel, Switzerland)|September 28, 2021
An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced PackagingSunil Kumar Panigrahy, Yi-Chieh Tseng, Bo-Ruei Lai, et al.
Chemphyschem : a European Journal of Chemical Physics and Physical Chemistry|October 2, 2009
Determining the zero-force binding energetics of an intercalated DNA complex by a single-molecule approachTzu-Sen Yang, Yujia Cui, Chien-Ming Wu, et al.
Pageof 1