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Dalton Transactions (Cambridge, England : 2003)|March 21, 2024
Molecularly-induced roughness and oxidation in cobalt/organodithiol/cobalt nanolayers synthesized by sputter-deposition and molecular sublimationCollin Rowe, Sathish Kumar Shanmugham, Grzegorz Greczynski, et al.ACS Nano|January 28, 2012
Two-dimensional transition metal carbidesMichael Naguib, Olha Mashtalir, Joshua Carle, et al.Applied Optics|August 12, 2008
Atomic scale interface engineering by modulated ion-assisted deposition applied to soft x-ray multilayer opticsFredrik Eriksson, Naureen Ghafoor, Franz Schäfers, et al.Nanotechnology|May 7, 2015
Structural and compositional evolutions of InxAl1-xN core-shell nanorods grown on Si(111) substrates by reactive magnetron sputter epitaxyElena Alexandra Serban, Per Ola Åke Persson, Iuliana Poenaru, et al.ACS Nanoscience Au|April 27, 2023
Self-Induced Core-Shell InAlN Nanorods: Formation and Stability Unraveled by Ab Initio SimulationsManoel Alves Machado Filho, Ching-Lien Hsiao, Renato Batista Dos Santos, et al.ACS Applied Materials & Interfaces|July 15, 2016
SiNx Coatings Deposited by Reactive High Power Impulse Magnetron Sputtering: Process Parameters Influencing the Nitrogen ContentSusann Schmidt, Tuomas Hänninen, Cecilia Goyenola, et al.Nanoscale|July 27, 2019
Synthesis of (V<sub>2/3</sub>Sc<sub>1/3</sub>)<sub>2</sub>AlC i-MAX phase and V<sub>2-x</sub>C MXene scrollsJimmy Thörnberg, Joseph Halim, Jun Lu, et al.Materials (Basel, Switzerland)|August 10, 2017
Decoration of ZnO Nanorods with Coral Reefs like NiO Nanostructures by the Hydrothermal Growth Method and Their Luminescence StudyMazhar Ali Abbasi, Zafar Hussain Ibupoto, Mushtaque Hussain, et al.Nanomaterials (Basel, Switzerland)|March 15, 2018
Influence of InAlN Nanospiral Structures on the Behavior of Reflected Light PolarizationYu-Hung Kuo, Roger Magnusson, Elena Alexandra Serban, et al.Scientific Reports|March 31, 2018
Enhanced Ti<sub>0.84</sub>Ta<sub>0.16</sub>N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayersMarlene Mühlbacher, Grzegorz Greczynski, Bernhard Sartory, et al.Pageof 7