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Mahad Saeed

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Communications Engineering|March 26, 2026
Co-packaged electronics with microfluidics for direct-to-package coolingHenry A Martin, Zihan Zhang, Mahad Saeed, et al.
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Showing results (1-10 of 1) with videos related to

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Pageof 1
Communications Engineering|March 26, 2026
Co-packaged electronics with microfluidics for direct-to-package coolingHenry A Martin, Zihan Zhang, Mahad Saeed, et al.
Pageof 1