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Micromachines
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November 27, 2021
Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors
Bei Wang, Ling Sun, Martin Schneider-Ramelow, et al.
Micromachines
|
July 29, 2023
Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration
Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, et al.
Materials (Basel, Switzerland)
|
November 6, 2019
Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads
Christian Dils, Lukas Werft, Hans Walter, et al.
Micromachines
|
May 26, 2019
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, et al.
Micromachines
|
November 15, 2018
Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application
Xiaodong Hu, Piotr Mackowiak, Manuel Bäuscher, et al.
Micromachines
|
June 4, 2020
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Ali Roshanghias, Marc Dreissigacker, Christina Scherf, et al.
Micromachines
|
May 6, 2020
Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS
Bei Wang, Manuel Baeuscher, Xiaodong Hu, et al.
Page
of 1
Search research articles
Search
Showing results (1-10 of 7) with videos related to
Sort By:
Page
of 1
Micromachines
|
November 27, 2021
Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors
Bei Wang, Ling Sun, Martin Schneider-Ramelow, et al.
Micromachines
|
July 29, 2023
Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration
Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, et al.
Materials (Basel, Switzerland)
|
November 6, 2019
Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads
Christian Dils, Lukas Werft, Hans Walter, et al.
Micromachines
|
May 26, 2019
Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Tanja Braun, Karl-Friedrich Becker, Ole Hoelck, et al.
Micromachines
|
November 15, 2018
Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application
Xiaodong Hu, Piotr Mackowiak, Manuel Bäuscher, et al.
Micromachines
|
June 4, 2020
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers
Ali Roshanghias, Marc Dreissigacker, Christina Scherf, et al.
Micromachines
|
May 6, 2020
Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS
Bei Wang, Manuel Baeuscher, Xiaodong Hu, et al.
Page
of 1