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Minjae Sung

Showing results (1-10 of 2) with videos related to

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Materials (Basel, Switzerland)|June 12, 2026
Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL SolderingDongGil Kang, HoGyeong Seong, JaeJun Yoon, et al.
ACS Omega|November 24, 2025
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass PackagingTaejoon Noh, Eun-Chae Noh, Minjae Sung, et al.
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Showing results (1-10 of 2) with videos related to

Sort By:
Pageof 1
Materials (Basel, Switzerland)|June 12, 2026
Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL SolderingDongGil Kang, HoGyeong Seong, JaeJun Yoon, et al.
ACS Omega|November 24, 2025
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass PackagingTaejoon Noh, Eun-Chae Noh, Minjae Sung, et al.
Pageof 1