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Light, Science & Applications|June 19, 2025
Non-contact and nanometer-scale measurement of PN junction depth buried in Si wafers using terahertz emission spectroscopyFumikazu Murakami, Shinji Ueyama, Kenji Suzuki, et al.
Optics Letters|February 25, 2014
Fourier spectrum method to determine dose-to-clear in a photoresistLei Sun, Obert Wood, Chris Clifford, et al.
Optics Express|May 8, 2023
Fourier ptychographic topographyHao Wang, Jiabei Zhu, Jangwoon Sung, et al.
Nanophotonics (Berlin, Germany)|December 5, 2024
Edge roughness analysis in nanoscale for single-molecule localization microscopy imagesUidon Jeong, Ga-Eun Go, Dokyung Jeong, et al.
Optics Express|December 23, 2022
Multi spectral holographic ellipsometry for a complex 3D nanostructureJaehwang Jung, Wookrae Kim, Jinseob Kim, et al.
Light, Science & Applications|May 28, 2024
Microsphere-assisted hyperspectral imaging: super-resolution, non-destructive metrology for semiconductor devicesJangryul Park, Youngsun Choi, Soonyang Kwon, et al.
Nature Communications|September 26, 2025
Ultra-wide-field imaging Mueller matrix spectroscopic ellipsometry for semiconductor metrologyJuntaek Oh, Jaehyeon Son, Changhyeong Yoon, et al.
Communications Engineering|February 22, 2025
Near-field terahertz time-domain spectroscopy for in-line electrical metrology of semiconductor integration processes for memorySunhong Jun, Inkeun Baek, Suhwan Park, et al.
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