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ACS Omega|December 20, 2021
Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead FramesNaoaki Tsurumi, Yuta Tsuji, Noriyuki Masago, et al.
Langmuir : the ACS Journal of Surfaces and Colloids|March 22, 2021
Theoretical Study on the Adhesion Interaction between Epoxy Resin Including Curing Agent and Plated Gold SurfaceYuta Tsuji, Taiki Baba, Naoaki Tsurumi, et al.
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