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Microscopy and Microanalysis : the Official Journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada|August 8, 2013
Microstructural study on Kirkendall void formation in Sn-containing/Cu solder joints during solid-state agingZhi-Quan Liu, Pan-Ju Shang, Feifei Tan, et al.
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