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Materials (Basel, Switzerland)
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June 24, 2022
Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps
Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, et al.
Materials (Basel, Switzerland)
|
November 11, 2022
Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration
Po-Yu Kung, Wei-Lun Huang, Chin-Li Kao, et al.
Advanced Materials (Deerfield Beach, Fla.)
|
February 11, 2026
Covalent Amorphous Alumina-Hydrogenated Graphene Materials With Integrated Proton Radiation Shielding and Energy Storage Capability for Space Electronics
Duc Dung Nguyen, Cher Ming Tan, Chia-Chen Hsu, et al.
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of 1
Search research articles
Search
Showing results (1-10 of 3) with videos related to
Sort By:
Page
of 1
Materials (Basel, Switzerland)
|
June 24, 2022
Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps
Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, et al.
Materials (Basel, Switzerland)
|
November 11, 2022
Investigation of Low-Pressure Sn-Passivated Cu-to-Cu Direct Bonding in 3D-Integration
Po-Yu Kung, Wei-Lun Huang, Chin-Li Kao, et al.
Advanced Materials (Deerfield Beach, Fla.)
|
February 11, 2026
Covalent Amorphous Alumina-Hydrogenated Graphene Materials With Integrated Proton Radiation Shielding and Energy Storage Capability for Space Electronics
Duc Dung Nguyen, Cher Ming Tan, Chia-Chen Hsu, et al.
Page
of 1