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Materials (Basel, Switzerland)|July 15, 2026
Ultrasonic Soldering of AlN/Cu Using SiC-Modified Zn5Al3Ti Active SolderTomas Melus, Roman Kolenak, Mikulas Sloboda, et al.
Materials (Basel, Switzerland)|April 28, 2023
Study of Bond Formation in Ceramic and Composite Materials Ultrasonically Soldered with Bi-Ag-Mg-Type SolderRoman Kolenak, Tomas Melus, Jaromir Drapala, et al.
Materials (Basel, Switzerland)|May 27, 2023
Characterization of Zn-Mg-Sr Type Soldering Alloy and Study of Ultrasonic Soldering of SiC Ceramics and Cu-SiC CompositeRoman Kolenak, Alexej Pluhar, Jaromir Drapala, et al.
Materials (Basel, Switzerland)|November 13, 2021
Characterization of Sn-Sb-Ti Solder Alloy and the Study of Its Use for the Ultrasonic Soldering Process of SiC Ceramics with a Cu-SiC Metal-Ceramic CompositeRoman Kolenak, Igor Kostolny, Jaromir Drapala, et al.
Materials (Basel, Switzerland)|June 27, 2025
Wettability Study of Soldered Joints in SiC Ceramics and Combined Ni-SiC Using SnSbTi-Based Solder and Electron Beam HeatingTomas Melus, Roman Kolenak, Jaromir Drapala, et al.
Materials (Basel, Switzerland)|August 14, 2025
Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in VacuumMikulas Sloboda, Roman Kolenak, Tomas Melus, et al.
Materials (Basel, Switzerland)|August 12, 2022
Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in VacuumRoman Kolenak, Igor Kostolny, Jaromir Drapala, et al.
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